Samsung's GAA processors; UMC's 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund; Infineon, ETAS auto security collab; quantum ...

Given computer vision’s place as the cornerstone of an increasing number of applications from ADAS to medical diagnosis and ...

Testing HBM; high density interconnect; SLM in aerospace and government. Cadence’s Vatsal Patel stresses the importance of ...

These new technical papers were recently added to Semiconductor Engineering’s library.

Researchers from the Max Planck Institute for the Science of Light and Massachusetts Institute of Technology found a way to build reconfigurable recurrent operators based on sound waves for photonic ...

Multi-die/multi-chiplet design has thrown a wrench into the ability to manage design complexity, driving up costs per ...

Overlay is becoming a significant problem in the manufacturing of semiconductors, especially in the world of advanced packaging substrates — think panels — the larger the area, the greater the ...

TSMC showed off its forthcoming A16 process technology node, targeted for the second half of 2026, at its 30th North American ...

President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic ...

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and ...

How neural network-based AI systems perform under the hood is currently unknown, but the industry is finding ways to live ...