Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale ...

This is where a shift-left strategy comes in. Analysis of the multiphysics effects of 3D-ICs (thermal, mechanical, etc.) in ...

By 2030, 6G is expected to be commercially available, revolutionizing connectivity with lightning-fast speeds, unprecedented ...

How neural network-based AI systems perform under the hood is currently unknown, but the industry is finding ways to live ...

There are two commonalities in all perspectives. Clearly, the flat, fully distributed architectures are a thing of the past. And all perspectives eventually arrive at some form of fully centralized ...

Alongside the high parallelism and high connectivity of wave optics, the chiplet explores a general and iterative ...

TSMC, SK hynix HBM deal; Intel's high-NA EUV; big haul for Micron, Samsung; Cadence's new emulation, prototyping systems; ...

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always ...

Of particular concern is electromigration, which is becoming more troublesome in advanced packages with multiple chiplets, ...

Multi-beam mask writers and curvilinear design stand out as key achievements.

What’s a sextillion? It’s the number one followed by 21 zeros — outnumbering the stars in the Milky Way. Industry analyst Jim ...

LPOs are driven directly by the switch SerDes, without re-timers. Re-timers, which extend reach by creating new signals, were ...